加工定制 是
貨號 49SMD
品牌 YXC
型號 HC-49SMD 32M
種類 晶振
標(biāo)稱頻率 32
調(diào)整頻差 20ppm
溫度頻差 25ppm
總頻差 50ppm
負(fù)載電容 20
負(fù)載諧振電阻 40
激勵電平 100
基準(zhǔn)溫度 -20~+70
插入損耗 -
阻帶衰減 -
輸入阻抗 -
輸出阻抗 -
數(shù)量 321542
商品介紹
HC-49SMD 貼片2P 請點擊您需要的參數(shù)一起加到購物車,找不到您需要的請聯(lián)系客服 標(biāo)準(zhǔn)頻率 負(fù)載電容 頻率偏差 點擊購買 3.6864MHZ 20PF 20PPM rel="nofollow" Buy 4MHZ 20PF 20PPM rel="nofollow" Buy 6MHZ 20PF 20PPM rel="nofollow" Buy 7.3728MHZ 20PF 20PPM rel="nofollow" Buy 8MHZ 20PF 20PPM rel="nofollow" Buy 10MHZ 20PF 20PPM rel="nofollow" Buy 11.0592MHZ 20PF 20PPM rel="nofollow" Buy 12MHZ 20PF 20PPM rel="nofollow" Buy 13.560MHZ 20PF 20PPM rel="nofollow" Buy 16.384MHZ 20PF 20PPM rel="nofollow" Buy 20MHZ 20PF 20PPM rel="nofollow" Buy 22.1184MHZ 20PF 20PPM rel="nofollow" Buy 24.576MHZ 20PF 20PPM rel="nofollow" Buy 24MHZ 20PF 20PPM rel="nofollow" Buy 25MHZ 20PF 20PPM rel="nofollow" Buy 26MHZ 20PF 20PPM rel="nofollow" Buy 27.120MHZ 20PF 20PPM rel="nofollow" Buy 27MHZ 20PF 20PPM rel="nofollow" Buy 28.6363MHZ 20PF 20PPM rel="nofollow" Buy 30MHZ 20PF 20PPM rel="nofollow" Buy 32MHZ 20PF 20PPM rel="nofollow" Buy 如您需要購買同類別的其他系列產(chǎn)品,請點擊以下鏈接 產(chǎn)品型號 產(chǎn)品規(guī)格 點擊購買 HC-49US 11.5x4.5x3.68mm rel="nofollow" Buy HC-49SMD 11.4x4.8x3.8mm rel="nofollow" Buy HC-49UM 11.05x4.65x13.46mm rel="nofollow" Buy YSX321SL 3225 4P rel="nofollow" Buy YSX530GA 5032 2P rel="nofollow" Buy YSX531SL 5032 4P rel="nofollow" Buy YT-26 2060 2P rel="nofollow" Buy YT-38 3080 2P rel="nofollow" Buy R315 D11,F11,TO39 rel="nofollow" Buy R433 D11,F11,TO39 rel="nofollow" Buy 石英晶振壓封條件 影響石英晶振平行封焊的因素還有夾具的設(shè)計、電極的位置、上蓋的質(zhì)量和上蓋與基座的匹配等,另外封焊設(shè)備本身的可靠性也是影響封焊質(zhì)量的因素之一。 夾具孔位的中心與轉(zhuǎn)臺中心要一致,夾具夾牢基座,否則焊接過程中電極可能會把基座粘起來;左、右電極位置保持在同一高度和同一水平線上且盡量對稱;電極滾輪要定期打磨和更換、否則會影響焊接均勻性;上蓋尺寸不能太大或太小,而且拐角有傾角,因為長方形基座的焊接電極與上蓋角接觸兩次,焊接熱量會影響焊接效果;采用邊緣有傾角的上蓋,焊接時錯位的可能性會大大減小。 工藝參數(shù)的設(shè)定要根據(jù)各公司的現(xiàn)狀而定,只有優(yōu)化工藝參數(shù),才能提高石英晶振焊接質(zhì)量。在石英晶振封焊完產(chǎn)品后,對封裝過程中出現(xiàn)的現(xiàn)象進行適當(dāng)?shù)目偨Y(jié),有待封裝技術(shù)的進一步提高。 真空平行縫焊(真空度在無負(fù)載、無封焊動作時可達1.1×10-3Pa),是在短邊封焊時加一道抽真空(真空度可達5×10-2Pa),后再封焊,其結(jié)果能大大的改善晶體的電阻指標(biāo)(可下降30~50%),適用于小尺寸、高指標(biāo)的產(chǎn)品。 平行封焊有半自動機,只完成上蓋點焊;滾焊密封由另一臺設(shè)備完成,中間銜接有人工搬運。全自動機是將真空烘烤、上蓋、點焊,滾焊密封、收納一機完成。

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